lsg 3331 3 mm (t1) multiled ? , non diffused 2001-03-12 1 besondere merkmale ? geh ? usetyp: nicht eingef ? rbtes, klares 3 mm (t1) geh ? use besonderheit des bauteils: antiparallel geschaltete chips; l ? tspie ? e mit aufsetzebene wellenl ? nge: 628 nm (super-rot), 570 nm (gr n) abstrahlwinkel: 40 technologie: gaalp optischer wirkungsgrad: 1,5 lm/w (super-rot), 2,5 lm/w (gr n) gruppierungsparameter: lichtst ? rke l ? tmethode: wellenl ? ten (ttw) verpackung: sch ttgut, gegurtet lieferbar anwendungen optischer indikator hinterleuchtung (lcd, schalter, tasten, displays, werbebeleuchtung, allgemeinbeleuchtung) innenbeleuchtung im automobilbereich (z. b. tastenhinterleuchtung, u. ? .) features package: colorless, clear 3 mm (t1) package feature of the device: anti-parallel chips; solder leads with stand-off wavelength: 628 nm (super-red), 570 nm (green) viewing angle: 40 technology: gaalp optical efficiency: 1.5 lm/w (super-red), 2.5 lm/w (green) grouping parameter: luminous intensity soldering methods: ttw soldering packing: bulk, available taped on reel applications optical indicators backlighting (lcd, switches, keys, displays, illuminated advertising, general lighting) interior automotive lighting (e.g. key backlighting, etc.)
2001-03-12 2 lsg 3331 streuung der lichtst ? rke in einer verpackungseinheit i v max / i v min 2 1) . streuung der lichtst ? rke in einer led i v max / i v min 3. 1) bei multiled ? bestimmt die helligkeit des jeweils dunkleren chips in einem geh ? use die helligkeitsgruppe der led. luminous intensity ratio in one packaging unit i v max / i v min 2 1) . luminous intensity ratio in one led i v max / i v min 3. 1) in case of multiled ? , the brightness of the darker chip in one package unit determines the brightness group of the led. helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11 % ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of ?1 %. anm.: die standardlieferform von serientypen beinhaltet eine untere bzw. eine obere familiengruppe oder mindestens zwei einzelgruppen. in einer verpackungseinheit / gurt ist immer nur eine helligkeitsgruppe enthalten. die technologiebedingte helligkeits-streuung der heutigen led-herstellprozesse ber einen l?ngeren fertigungszeitraum (halbleitermaterial - chipherstellung - montageprozesss) erlaubt keine zusage einer einzelnen helligkeitsgruppe. daher mssen mindestens zwei helligkeitsgruppen vorgesehen werden! note: the standard shipping format for serial types includes a lower or upper family group or at least two individual groups. no packing unit / tape ever contains more than one luminous intensity group. luminosity variations caused by the technology used in current led manufacturing processes over a protracted manufacturing period (semiconductor material - chip fabrication - assembly process) mean that it is not possible to assign leds to a single luminous intensity group. for this reason at least two luminous intensity groups must be provided! typ type emissionsfarbe color of emission geh ? usefarbe color of package lichtst ? rke luminous intensity i f = 10 ma v (mcd) bestellnummer ordering code lsg 3331-jo super-red / green colorless clear 4.5 (18 typ.) q62703-q2296
lsg 3331 2001-03-12 3 bezeichnung parameter symbol symbol wert value einheit unit betriebstemperatur operating temperature range t op ? 55 ? + 100 c lagertemperatur storage temperature range t stg ? 55 ? + 100 c sperrschichttemperatur junction temperature t j + 100 c durchlassstrom forward current i f 40 ma sto ? strom surge current t 10 s, d = 0.005 i fm 0.5 a leistungsaufnahme power consumption t a 25 c p tot 130 mw w ? rmewiderstand thermal resistance sperrschicht/umgebung junction/ambient sperrschicht/l ? tpad junction/solder point montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 ) minimale beinchenl ? nge minimum lead length r th ja r th js 400 180 k/w k/w
2001-03-12 4 lsg 3331 bezeichnung parameter symbol symbol werte values einheit unit ls lg wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 10 ma peak 635 572 nm dominantwellenl ? nge 1) (typ.) dominant wavelength i f = 10 ma dom 628 570 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 10 ma ? 45 25 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 40 40 grad deg. durchlassspannung 2) (typ.) forward voltage (max.) i f = 10 ma v f v f 2.0 2.4 2.0 2.4 v v temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f = 10 ma; ? 10 c t 100 c tc peak 0.11 0.11 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 10 ma; ? 10 c t 100 c tc dom 0.07 0.07 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 10 ma; ? 10 c t 100 c tc v ? 1.9 ? 1.4 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 10 ma opt 1.5 2.5 lm/w 1) wellenl ? ngen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 1 nm ermittelt. wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) spannungswerte werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von ?,1 v ermittelt. voltages are tested at a current pulse duration of 1 ms and a tolerance of ?.1 v.
lsg 3331 2001-03-12 5 relative spektrale emission i rel = f ( ), t a = 25 c, i f = 10 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic % rel ohl01702 100 80 60 40 20 0 400 450 500 550 600 650 700 nm i green super-red v 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01657 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
lsg 3331 2001-03-12 6 durchlassstrom i f = f ( v f ) forward current t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current relative lichtst ? rke i v / i v(10 ma) = f ( i f ) relative luminous intensity t a = 25 c relative lichtst ? rke i v / i v(25 c) = f ( t a ) relative luminous intensity i f = 10 ma 10 -1 v 5 ohl01263 i f f v 0 10 1 10 2 10 5 ma 1 1.4 1.8 2.2 2.6 3 3.4 ohl01092 0 0 20 40 60 80 ? c 100 t i f temp. ambient temp. solder point a s t t a t s t 10 20 30 40 50 ma v v (10 ma) 10 -1 0 10 10 12 10 ma 10 -3 5 ohl01703 f i 5 -2 10 5 -1 10 0 10 1 10 i i 55 green super-red green super-red 0 ohl01708 ? c a t 0 20 40 60 80 100 v v (25 ? c) i i 0.4 0.8 1.2 1.6 2
lsg 3331 2001-03-12 7 zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c ohl01162 s 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t d i t t p f t p = d = 0.005 0.01 0.02 0.05 0.1 0.2 0.5 dc 10 1 5 i f t 2 10 3 10 4 10 5 ma p
2001-03-12 8 lsg 3331 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). kathodenkennung: gr ? n: l ? ngerer l ? tspie rot: k ? rzerer l ? tspie cathode mark: green: long solder lead red: short solder lead gewicht / approx. weight: 0.15 g 3.6 (0.142) 4.0 (0.157) 5.9 (0.232) 6.3 (0.248) 2.9 (0.114) 3.1 (0.122) 5.2 (0.205) 4.5 (0.177) 4.1 (0.161) 3.9 (0.154) gexy6729 circuit diagram cathode red area not flat 0.6 (0.024) 0.4 (0.016) 2.54 (0.100) spacing 0.6 (0.024) 0.4 (0.016) 0.7 (0.028) 0.4 (0.016) 0.4 (0.016) 0.8 (0.031) 29.0 (1.142) 27.0 (1.063) 1.8 (0.071) 1.2 (0.047) cathode green
lsg 3331 2001-03-12 9 l ? tbedingungen soldering conditions wellenl ? ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) empfohlenes l ? tpaddesign wellenl ? ten (ttw) recommended solder pad ttw soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangsk ? hlung forced cooling normalkurve standard curve grenzkurven limit curves 4 (0.157) ohlpy985 4.8 (1.890)
2001-03-12 10 lsg 3331 published by osram opto semiconductors gmbh & co. ohg wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2001-03-12 previous version: 2001-03-12 page subjects (major changes since last revision)
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